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The Lumentum APD chip is an indium phosphide (InP) based device designed for high performance telecoms receiver applications up to 11.3 Gbps. The optical signal is received via top illumination of the central active region through a ring shaped contact which provides a 30 μm aperture.    A reverse electrical bias is applied across the active region by the P (anode) and N (cathode) contacts. The circular P bond pad has a diameter of 70 microns suitable for wire bonding.