ABERRATION meaning: something (such as a problem or a type of behavior) that is unusual or unexpected.

This was for a ceiling light over a home bar. I compared this versus the 11.5W (1100 lumens / "75W incandescent equivalent") version, and they both work. The ...

APS-C

Quality assurance and integrated automation play a very important role in manufacturing companies. In the factory of the future, an ever-increasing amount of measurement data will be generated for this purpose

Olympus has demonstrated how a stacked (it calls it 3D) architecture can create new possibilities with its research prototypes of a BI sensor, with a nearly perfect shutter that it calls a "global" shutter. Like a rolling shutter the global shutter can work nearly instantly and without any moving parts, but avoids artifacts by placing the read out electronics on a lower layer behind a shield. Since it takes time to read all the data from a sensor, a rolling shutter can create smearing or other artifacts because the sensor is still actively receiving photons while the voltages are being read. The Olympus design transfers all of the charge off the sensor at once -- to the lower, shielded layer -- where they can then be read out accurately.

The magic that makes camera sensors possible is also what makes them difficult to build with the receptors on top. Because silicon is both the substrate for the sensor chip and the light-sensitive material, it wants to be both at the top and the bottom of the sensor at the same time. Traditional sensor designs simply start with the silicon and pile everything else on top. That allows for a single, relatively thick, layer of silicon and a straightforward manufacturing process.

Oct 21, 2024 — Allows user to open a new NPS account, manage their NPS portfolio with series of features like making voluntary contribution, ...

Sony sensor

Even in low light-conditions users get clear images what makes the GigE industrial camera recommended especially for applications in traffic monitoring and quality assurance.

Sony STARVIS

RODE, the ac­ronym for RO­bot­ic DE­pal­let­iser, is a pi­on­eer­ing product from AWL in the in­t­ra­lo­gist­ics mar­ket. The ro­bot­ic solu­tion is able to ef­fi­ciently pro­cess pack­ages ran­domly ar­ranged on a pal­let, set­ting it apart from con­ven­tion­al sys­tems.

2023212 — There are four main types of digital camera: compact, bridge, DSLR and mirrorless cameras. DSLRs and mirrorless models have interchangeable ...

2021314 — Distinguere i due tipi di obiettivi è facile nella nomenclatura: gli obiettivi zoom hanno due valori di lunghezza focale, come per esempio 18- ...

The GigE industrial camera UI-5260CP with Sony IMX249 CMOS sensor (1920 x 1200 px, 41 fps) has been released by IDS Imagine. The 2.3 Megapixel Sony IMX249 sensor provides quite the same features as its "bigger brother" Sony IMX174 and it is therefore considered the cost-effective alternative to the IMX174.

As you'd expect, putting the photodiode at the bottom of a well reduces the amount of light that reaches it, with some light bouncing off the wiring above, and some just not having the right angle to make it to the bottom of the well. Microlenses are used to reduce this problem (the human eye uses waveguides  known as Muller cells), but a meaningful amount of light is still lost before it gets to the photodiode to be captured. Typical sensor fill factors -- the portion of light successfully captured -- range from 30% to 80%. By contrast, a back-illuminated sensor can have a fill factor of nearly 100%.

If a sensor was only a layer of photosensitive silicon, it wouldn't matter much which side was up. A pixel is a lot more than just the photodiode, however. It typically includes transistors and wiring for amplifying the charge, transferring it to the signal processing portion of the chip, and resetting itself between frames. Those electronics get placed on top of the silicon layer, partially obscuring it from the light and resulting in a well-like appearance for a typical pixel.

A 400 μm core, 1 meter length multimode optical fiber. Steel armoured sleeve and protective endcaps included.

Silicon is both the substrate on which chips are built and the material that performs the magic of turning photon energy into electrical energy that can be used to create images. It is therefore the simplest solution to create the photosensitive areas in the substrate silicon and stack the electronics on top -- leaving openings in the wiring over each photosite (pixel) to allow light to pass through. As camera resolutions have increased, pixel sizes have decreased, especially in smartphones with their tiny sensors. The result is that more and more of the surface area of the sensor is covered by wiring, resulting in less and less light reaching the photosites. So there is a natural need to find a way to move the photosensitive region to the top of the chip, allowing it to gather more light.

Sensor format

The UI-5260CP is available as color or monochrome version, including the IDS Software Suite that supports all features of the IMX249 sensor beginning with driver version 4.71, for example long exposure up to 30 seconds. The software provides the same plug and play experience for GigE cameras like for the manufacturer's USB models.

3D imaging processing can massively improve the flexibility and accuracy of measurement and test processes for an early detection of defects and irregularities in production processes

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To get a silicon layer on top of the sensor, it is necessary to build the chip the same way as a traditional front-illuminated sensor, but then place another layer of silicon substrate on top and flip the entire silicon sandwich over. After that comes the hard part. The original base layer of silicon, which is now on top, has to be thinned to make it act as a light-sensitive layer.

The GigE industrial camera UI-5260CP with Sony IMX249 CMOS sensor is now available in IDS' uEye CP camera series with either USB 3.0 or Gigabit Ethernet interface. The last-mentioned is "powered over Ethernet", providing data transmission and power supply with only one cable. The small industrial camera measuring only about 29 x 29 x 41 mm is equipped with 60 MB memory for caching images.

Optical format

The pro­cessing of im­age data plays a cru­cial role in many in­dus­tri­al sec­tors, wheth­er in qual­ity as­sur­ance, pro­duc­tion mon­it­or­ing or ro­bot­ics. AI-based sys­tems open up many new pos­sib­il­it­ies and solve chal­lenges that were pre­vi­ously dif­fi­cult to over­come, even in ex­ist­ing in­dus­tri­al ap­plic­a­tions. This is be­cause trained neur­al net­works can re­cog­nize com­plex pat­terns, identi­fy an­om­alies and even pre­dict tool fail­ures, lead­ing to a sig­ni­fic­ant im­prove­ment in pro­cess per­form­ance.

You don't have to worry about inserting it the wrong way, as the connector is shaped so that it only fits in one way. People often use the term "4 pin Molex ...

Sony IMX623 Datasheet

Light bouncing around inside the electronics can also cause other problems such as vignetting and crosstalk. Thus a design which puts the photodiodes on top is clearly desirable. Having the photosensitive area on the side of the chip facing the light also dramatically improves the angular response of the sensor. No longer does light have to be aimed "down the well" of the pixel, but it can strike it from nearly any angle.

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Graduated in political sciences and international relations in Paris, Anis joined the team in early 2019. Editor for IEN Europe and the new digital magazine AI IEN, he is a new tech enthusiast. Also passionate about sports, music, cultures and languages.

IMX811

... avvolgimenti - per uso generale ... schemi elettrici di collegamento inseriti nella scatola morsettiera del motore. I suddetti motori autofrenanti, se ...

Better light sensitivity is just the beginning of what backside illumination makes possible. Sony has shown that BI technology allows creating a sensor from a stack of chips instead of a single chip -- so that the top chip can be optimized for capturing the light and the ones underneath can do the signal processing. A stacked design allows for additional processing at the pixel level without reducing the sensor's light sensitivity. Recent advances in through-silicon vias (TSVs; interconnects between a 3D stack of chip dies) have made this type of layering possible. This stacking is the same technology that is used in multi-layer memory chips, so it is getting significant investment.

Users who do not want to primarily benefit from the speed and the range of features of the IMX174, they opt for the cost-effective option IMX249, delivering 41 fps at full resolution in IDS' GigE camera.

Sony has already started sampling a stacked version of a BI chip with its Exmor RS, which is expected to ship in volume this year. As BI technology continues to improve, look for Sony to be one of the first companies to use it in their larger sensor cameras. The larger pixel size of APS-C and full-frame cameras allows a high fill factor even with traditional front-illuminated technology, but as BI gets cheaper and stacked systems allow additional features, expect it to begin to appear in mirrorless and DSLR cameras.

Backsideilluminated

Omnivision helped pioneer the use of BI sensors in 2007, but until recently they have been too expensive for production use. Sony's Exmor R in 2009 was one of the first production sensors to use back-illumination -- nearly doubling its low-light sensitivity compared to other similar chips. Back-illumination broke into the mainstream when it was used in flagship phones including the Apple iPhone 4 and the HTC EVO 4G.

The Ortofon 2M Red is a Moving Magnet (MM) phono cartridge from the 2M Series. With the 2M Red, you will hear the music come to life on its own terms.