Norland Adhesives

Larger, higher-power devices such as ASICs and FPGAs are the norm in 5G telecom infrastructure gear, data center switches, routers and servers, as well as electric vehicle (EV) infrastructure and industrial automation electronics. As component density and complexity increase in response to faster data processing and ...

Material solutions that build the foundation for high-speed connectivity and reliable high bandwidth data access management networks

NorlandOptical Adhesive

A full suite of non-conductive and conductive adhesives provide strong bonds, electrical interconnection, lens and fiber alignment integrity and secure long-term performance by mitigating thermal and/or mechanical interference.

Dual Cure, Active Alignment Optical Adhesive Delivers High Precision Performance for Optimal Transceiver Signal Integrity

Optical AdhesiveFilm

Smaller footprints, faster processing power, improved long-term reliability and cost-effectiveness are just some of the many – often contradictory – requirements for optical communications devices including transceivers, switches and components. Inside these systems are complex assemblies of lenses, laser diodes and fibers that require durable adhesion, precise alignment, lifetime protection and effective heat dissipation to cope with higher power densities, provide optimal light transmittance with low signal loss, and protect against thermal and mechanical stress. Learn how Henkel’s portfolio of innovative, high performance optoelectronics materials are helping achieve big data ambitions.

The decreasing dimensions and increasing power densities of high speed, high  bandwidth devices result in significant operational heat. Dissipation of the thermal load is central to performance at maximum capacity. Thermal interface materials in pad, liquid, adhesive and gel formulations provide the thermal control and processability capabilities required.

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Optoelectronics are the foundation of the greater networking bandwidth and data processing capabilities of modern data center and network technologies, including metro, long haul and sub-sea data center interconnect (DCI). The insatiable quest for ever-increasing data rates is being satisfied by advanced optical components such as optical transceivers, switches and components that leverage the efficiency of light to help move high volumes of global network traffic at incredibly fast speeds. Henkel’s material solutions keep these devices reliably connected, protected and thermally controlled for optimized function.

Delivering multi-user access to high-speed broadband signals from a single optical cable requires a high-performance optical distribution network, with the optical line terminal (OLT) at the central hub disseminating the signal to multiple end points, or optical network units (ONUs).

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Safeguarding small form factor components and fibers from mechanical and thermal stress extends functional lifetime and preserves reliable operation.

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To manage the greater data bandwidth needs inherent with 4k rich media streaming, machine learning, data mining, and analytics, next-generation hyper-scale and cloud-scale datacenters are transitioning to the 400 gigabit ethernet (GbE) standard.

Optical transceivers, switches and components are the engines of expansive data networks for metro, long haul, sub-sea and data center interconnect (DCI). Cost-effective and high-speed capable, optical devices have transformed in recent years, becoming smaller in size, using less power while increasing data throughput.

Irvine, CA – Staying ahead of thermal management requirements for increasingly challenging datacom, telecom and industrial automation applications, Henkel today announced the commercialization of its latest gel thermal interface material (TIM), BERGQUIST® LIQUI FORM TLF 10000.  The one-part, high thermal conductivity dispensable gel is designed to provide robust heat transfer for high-power electronic components, improving operational efficiency and extending lifetime system reliability.

Novel Thermal Management Coatings Aid in Reducing Operational Heat in Cloud and Hyperscale Data Center Optical Transceivers