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To standardize the names of different modules, a naming convention is defined in PCI Express M.2 Specification Revision 4.0 Version 1.0. The following table defines the size, component assembly (single-/double-sided, maximum height), interface, and other important information about the card.

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The M.2 specification identifies 12 key IDs on the module card and socket interface, but M.2 SSDs typically use three common keys: B, M, and B+M. You will find the key type labeled on or near the edge connector (or gold fingers) of the SSD.

The card name provides several information about your M.2 card. For example, connectorized SSDs typically come in three dimensions: 2242, 2260, and 2280. The first two digits represent the width in millimeters (mm), while the last two digits represent the length in mm.

M.2 SSDs support both NVMe protocol using PCIe interface and AHCI using SATA interface.ATP offers connectorized modules supporting NVMe and SATA as well as soldered-down NVMe heatsink BGA (HSBGA) SSDs.

We have been transforming the industrial and enterprise computing landscape with our high-performance and high-endurance NAND flash storage products and DRAM memory modules.

For connectorized solutions like the NVMe M.2 2280, ATP offers customizable Thermal Management Solution, which includes copper foil and fin-type heatsink options. They are recommended for applications requiring stable and sustained read/write performance at high temperatures.

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To ensure proper installation of M.2 modules, the M.2 standard in PCI Express M.2 Specification Revision 4.0 Version 1.0 has clearly distinguished “sockets” on the host. Each socket has a unique mechanical key, and modules are not interchangeable between sockets.

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For soldered-down solutions like the NVMe M.2 HSBGA, these SSDs are outfitted with a heatsink on top, which complements system airflow to enhance heat dissipation and keep the BGA SSD cool while offering 2X-3X better sustainable performance.

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Supporting high-speed PCIe 3.0 interface x4 lanes and NVMe protocol, this tiny SSD delivers up to 32 Gb/s bandwidth at 8 Gb/s per lane. BGA SSD technology allows the NAND flash and controller to be integrated into one package that is lightweight yet offers powerhouse performance, ample capacities, and other advanced features to meet the portability and reliability requirements of ultra-compact Internet of Things (IoT) devices and embedded systems.

For more information on ATP’s extensive range of products and services, please visit https://www.atpinc.com/ or contact an ATP Representative in your area.

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M.2 (pronounced “M dot two”) is a compact card or module form factor supporting multiple protocols and applications. It was developed by PCI-SIG and SATA-IO. The M.2 comes in two main formats:

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Soldered-down solutions such as ATP’s M.2 Type 1620 heatsink ball-grid array (HSBGA) offers NVMe performance in a shock/vibration resistant package, while the 291-ball packaging takes up minimal space within tightly confined systems. The optimized power consumption of just 5 mW during Power State 4 (Sleep Mode) also translates to big power savings.

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This module is 22 mm wide and 42 mm long; it is double-sided, with components installed on both top and bottom not exceeding 1.35 mm in height; and, it is “B+M” keyed.

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For an in-depth discussion on how NVMe M.2 SSDs differ from SATA M.2 SSDs, please have a look at a previous blog entry here.