EUV is like a high-precision scalpel for creating the most delicate features, while DUV remains a versatile workhorse for general chip manufacturing. The choice often involves a trade-off between cost, performance, and feature size requirements.

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For high-volume chip production where cost and speed are crucial, deep ultraviolet (DUV) might still be preferred for some layers of the chip. However, for cutting-edge chips where maximising transistor density and performance is paramount, EUV becomes the necessary technology, especially for the most intricate layers of the circuit.

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Extreme ultraviolet (EUV) lithography is a cutting-edge technique to manufacture modern computer chips. It’s a type of photolithography, which utilises light to etch patterns onto silicon wafers, the foundation of integrated circuits (ICs).

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Even though EUV Lithography is one of the most advanced techniques out there, it has its benefits and drawbacks to consider:

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EUV lithography is considered better than conventional photolithography for certain aspects of chip manufacturing, particularly when it comes to miniaturisation and finer feature size.

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EUV lithography involves an interplay of light, engineering and material science. The following is a step-by-step breakdown of the process: